A tantalum compound consisting of brown to black hexagonal crystals. Tantalum nitride is insoluble in water and melts at approximately 3360 degrees Celsius. A chemically inert refractory compound. It is probably the most widely employed resistor material in thin film applications.
Tantalum Nitride (TaN) Powder Nominal Chemical Properties Available:
A barrier metal used in Cu metallization scheme. Tantalum nitride (TaN) films have been shown to provide a barrier to copper diffusion while at the same time promoting good adhesion between the copper lines and the surrounding interlevel dielectric (ILD).
Tantalum Nitride (TaN) Powder Packaging Options:
50 lbs. net weight bags, drums, and bulk bags
Tantalum Nitride (TaN) Powder TSCA (SARA Title III) Status:
Listed. For further information please call the E.P.A. at +1.202.554.1404
Tantalum Nitride (TaN) Powder Chemical Abstract Service Number: