Aluminum Nitride (AlN) Granules and Powder from READE

aluminum nitride, AlN, 24304-00-5, powder, granule, crystal, rod, targets, aluminum nitride, AlN, 24304-00-5, powder, granule, crystal, rod, targets

Reade Advanced Materials offers:

Aluminum Nitride Powder

Aluminum Nitride Key Words:

Aluminum nitride, AlN, 24304-00-5, powder, crystal, rod, target, piece
Aluminum Nitride Formula:

AlN

Aluminum Nitride Description:

It is stated that AlN has 10-15 times greater thermal conductivity, 50-75% greater bending strength, and a coefficient of thermal expansion more closely matching that of silicon. A light tan/ white to gray powder which can be fired to translucence

Aluminum Nitride Typical Chemical Properties Available:

a) Typical chemistry: N= 33.6% min., Al= 65.4% min. Purities are available from 99% (industrial grade) to 99.8% (high purity grade).

b) Three different basic AlN chemistries are available

Aluminum Nitride Typical Physical Properties Available:

a) Single crystals, sintered pieces, rods, targets, pellets, whiskers, grinding media, coarse grains for fillers, and fine powder

b) Granules and powder are available from as coarse as 60 mesh (250 microns) and finer down to a 0.5 micron product. The finest commercial grade available in tonnage lots has an average agglomerated particle size of approximately 1.8 microns.

Aluminum Nitride Nominal Physical Constants:

Molecular Weight (g/mol.)	40.99
Apparent Density (g/cm³)	3.26
Tap Density (g/cm³)	0.40 - 0.57
Melting Point (°C)	> 2200
Boiling Point (°C)
Specific Surface Area (m²/g)	2.7 - 3.4
Thermal Conductivity (W/mK)	100- 220
Mohs Hardness @20°C	7
pH	6.3
Specific Gravity	3.26
Crystal Phase	single phase AlN
Crystallography	hexagonal
Color	white

aluminum nitride, AlN, 24304-00-5, powder, granule, crystal, rod, targets, aluminum nitride, AlN, 24304-00-5, powder, granule, crystal, rod, targets

Typical Applications:

High thermally conductive ceramics, translucent ceramics, Si-Al-O-N compounds, high temperature materials, additives, heat sinks, power and multichip modules, refractories, ceramic armor, break rings, coatings, insulators, heat radiation plates, optoelectronic devices, metal matrix composites, thermally conductive filler, IC packages and substrates

Typical Packaging:

50 lbs. bags, poly-lined fiber drums and bulk bags

TSCA (SARA Title III) Status:

Yes

CAS Number:

24304-00-5

UN Number:

1759 and 3132

East Coast USA: +1-401-433-7000 / West Coast USA: +1-775-352-1000 / Latin America: +507-314-1282